Introduction
The semiconductor industry faces ongoing challenges in improving device performance, reducing manufacturing costs, and minimizing environmental impact. Traditional Metal-Organic Chemical Vapor Deposition (MOCVD) methods often struggle with precursor utilization, growth rates, and film uniformity, particularly for larger wafer sizes. At OTSON Technologies Corp, we are pioneering a novel hybrid MOCVD technique that integrates liquid precursor spray deposition with conventional gas-phase reactions and advanced AI-driven process controls. This innovative approach addresses the limitations of traditional MOCVD, offering a cost-effective and efficient solution for semiconductor device fabrication.
Key Benefits
- Cost Reduction: Up to 80% reduction in cost per wafer due to enhanced precursor efficiency.
- Higher Growth Rates: Achieving up to 200% faster growth rates compared to traditional MOCVD.
- Improved Film Uniformity: Superior control over liquid precursor deposition, resulting in highly uniform films with reduced defect density.
- AI-Driven Optimization: Utilizing artificial intelligence to monitor and optimize deposition processes in real-time, ensuring consistent quality and efficiency.